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Huawei Unveils Five New AI Service Solutions At HUAWEI CONNECT 2026 Global Summit

  • September 22, 2026
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Huawei unveiled five new solutions along with an upgraded version of its O3 platform services at a summit held during HUAWEI CONNECT 2026 in Shanghai, aimed at helping enterprises integrate AI technologies more directly into their core production systems. Bruce Xun, President of Huawei’s Global Technical Service Department, said the company is working with partners to strengthen its service delivery capabilities, citing a recent project in which Huawei shortened the integration and delivery timeline for a 50 MW AI data center to four months through pre-integration and coordinated project management.

Among the five new solutions, Huawei introduced a network integration offering designed to allow enterprises to migrate or change networks without service interruption, using a network integration agent paired with digital twin technology. The company also introduced computing platform services covering the full lifecycle of computing infrastructure, along with an industry operations and maintenance solution that Huawei said reduces major faults by 10 percent and cuts fault localization time from 30 minutes to 5 minutes through digital twin modeling and predictive risk assessment.

The remaining two solutions target specific sectors, including a mobile money offering for retail banking that Huawei said reduces customer acquisition costs by 90 percent through a super app model, while using algorithmic credit assessment to raise credit approval rates from 15 percent to 45 percent. Huawei also introduced a talent development solution aimed at training professionals with combined expertise in ICT and AI, with the company stating it has already trained more than 100,000 AI professionals and certified over 50,000 of them across various industries.

Alongside the five new solutions, Huawei also detailed upgrades to its O3 Partner Service Enablement Platform, including a software as a service offering allowing partners to build their own customer facing service platforms, more than 60 scenario specific service capability packages, and over 20 AI agent applications designed to automate individual and cross workflow tasks. Several organizations shared how they have applied Huawei’s technology in practice, including the Industrial and Commercial Bank of China, which described an integrated build and maintenance approach for AI computing clusters, and Meralco in the Philippines, which is working with Huawei on a grid edge operations project to modernize its distribution network. Siinqee Bank in Ethiopia also detailed a partnership with Huawei to build an integrated digital finance platform covering payments, wallets, deposits, and loans, aimed at expanding access to financial services. HUAWEI CONNECT 2026 ran from September 17 to 19 at the Shanghai World Expo Exhibition and Convention Center, with this year’s event themed around AI strategy, technology, and ecosystem development.

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Follow the SPIN IDG WhatsApp Channel for updates across the Smart Pakistan Insights Network covering all of Pakistan’s technology ecosystem.

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Related Topics
  • AI computing
  • Digital Twins
  • enterprise AI
  • Huawei
  • HUAWEI CONNECT 2026
  • ICBC
  • Meralco
  • O3 platform
  • Siinqee Bank
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